General introduction of probe type, don't choose blindly anymore!

The main application areas of semiconductor test probes include chip design verification, wafer testing and finished semiconductor testing. It plays a central role in connecting the chip with the test equipment and transmitting signals, which is of great significance to the quality control of semiconductor products.

1, the probe product structure can be analyzed and tested

probe station is generally composed of precision instruments riveted pre-pressure, needle, needle tail, spring, the outer tube of the four basic components.

Due to the semiconductor products, especially the chip product size is small, the probe size is required to reach the micron level. It is a high-end precision electronic component with high manufacturing technology.

In wafer or chip test probe, the probe is usually used to accurately connect the pin or tin ball of the wafer or chip to the tester to test the conductivity, current, functionality and aging performance indicators of the product.

The probes for different applications have different appearances, but basically have a precision spring structure inside. The surface of the product is usually gold-plated to enhance corrosion resistance, electrical performance, stability and durability.

Probe for structural system design (such as needle shape) as a semiconductor test and research equipment, key core components, needle materials (such as tungsten, snipe copper), elasticity of the size of the probe will have an impact on the probe's stability, subtlety, signaling accuracy, etc., which can affect the accuracy of the test results of the probe.

2. Classification and testing of probe structure

As far as the structure is concerned, the common types of probes are mainly elastic probes, cantilever probes and vertical probes.

Elastic Probes

An elastic probe is a probe consisting of a coil spring with its ends attached to the upper and lower post bolts. The center portion of the coil spring is tightly wound to prevent additional inductance and attachment resistance. The ends of the spring are wound thin to minimize the pressure of the probe on the object under test. In IC detection, the signal will flow from the lower pin to the upper pin,micromanipulator creating a conductive path.

Cantilever Probe

Cantilever probes provide proper longitudinal displacement of the probe section to contact the semiconductor product to be measured by means of a transverse cantilever to avoid excessive pin pressure on the semiconductor product to be measured by the probe section.

Vertical Probes

Vertical probe technology can be carried out corresponding to a high density of signal contacts of the semiconductor company products to be measured in a fine pitch arrangement, the tip of the needle to contact the semiconductor company products to be measured in the longitudinal displacement analysis required for the development of the product can be provided at the same time through the elastic deformation of the needle body itself.

3. Classification of probe materials

According to the probe material classification, common tungsten probe, vanadium copper probe and tungsten alloy probe.

Among them, tungsten condylar alloy probe technology has a socially stable contact a resistance, taking into account the hardness and flexibility, and is not easy to manage the occurrence of probe deviation. Therefore, tungsten condylar alloy probe is currently in use as well as good performance of a more common probe.

4. Test probe working frequency classification

According to the working frequency of different probes, probes can be divided into coaxial probes and ordinary probes.

Coaxial probes are used for testing frequency sensitive test environment, ordinary probes are used for signal attenuation is not sensitive to the test environment.

01 Coaxial Probe

Coaxial probes are similar to coaxial probes, with a protective layer of copper tubing around the probe, and filled with dielectric material between the copper tubing and the probe.

02 Ordinary Probe

Ordinary probes are alloy probes exposed to air, usually covered with an insulating layer around the ordinary probe to prevent cross-wiring short circuit.

5. The position of probes in the semiconductor industry chain

Due to the production and development process of semiconductor products is also very complex, any one of the teaching aspects of some errors may lead to a large number of products and services of the enterprise quality is not qualified, and even the final application for the performance of the product to have a significant social impact. Therefore, the test in the production of semiconductor products in the business process needs to have a very important position in China, throughout the design of semiconductor products, manufacturing, packaging and application of the entire learning process.

Probe is an important consumable for semiconductor testing. By cooperating with tester, sorter and probe table, it can screen out design defects and manufacturing defects for design verification, wafer testing and finished product testing. It plays an important role in ensuring product yield, controlling costs, and guiding chip design and process improvement.

6. The impact of probes on semiconductor packaging and testing links

Probe is an important equipment for semiconductor product testing. Its quality has an important impact on the test results of semiconductor products, production efficiency and cost control.

Probe product quality is mainly reflected in the test bandwidth, product size, processing accuracy, load current, durability and other aspects.