Layers upon layers of high-tech processes go into semiconductor science

After introducing what silicon is, I also learned that making IC chips is like building a house with Lego bricks, stacking them one after the other until the desired shape is achieved. As with building a house, there are quite a few steps involved in manufacturing an integrated circuit chip. anti vibration table This paper will discuss the manufacturing process of integrated circuit chips.

Chip architecture layered upon layer

Prior to starting, it is essential to grasp the concept of an IC chip. semiconductor test This abbreviation stands for Integrated Circuit and is renowned for its ability to integrate multiple circuits in a compact manner. By doing so, the amount of space needed for circuit connections is minimized. A visual representation of this can be seen in the 3D diagram below, illustrating the layered structure resembling that of a house's beams and columns. This analogy reflects the process of constructing an IC chip, similar to building a house.

(Source: Wikipedia) The 3D part of the IC chip.

A 3D cross-section of the IC chip is shown in figure above, with the dark blue part at the bottom representing the wafer discussed previously. Taking a look at this figure, we can see how crucial the wafer substrate is to the chip's success. It is here that the IC is located, as shown by the red and khaki parts.

The red portion represents the first floor hallway of a tall building. voltage probe Similar to a house's entrance, this hallway serves as the access point and controls traffic flow. As a result, its construction is more intricate and involves multiple steps compared to other floors. In an IC circuit, this area functions as the logic gate layer - a crucial component that brings together various logic gates to create a fully operational IC chip.

The yellow section resembles a typical floor and is simpler in design compared to the first level. Each subsequent level will also remain relatively unchanged during construction. Its main purpose is to link the red logic gates. As there are numerous threads to be connected, multiple layers are necessary to accommodate them all. Hence, various layers of wiring will be utilized to meet the necessary requirements.

A layer-by-layer construction

We need to explain how to make IC after we know its structure. For example, if we want to draw a fine drawing using a paint spray can, we must cut out the figure's cover plate and paste it on the paper. After spraying evenly, let the paint dry before removing the shield. Repeating this process over and over will allow you to create a neat and complex pattern. IC manufacturing is a similar approach, covering the way layer by layer.

Integrated circuits are made in four steps. While the actual manufacturing process may vary, as can the materials used, certain principles are universally applicable. There are differences between this process and paint coating in that IC manufacturing is the first coating and then the cover, whereas paint coating is the first cover and then the coating. Each process is described below.

In metal sputtering, a thin film of metal material is evenly sprinkled onto the wafer.

Photoresist is made by placing a photoresist material on a wafer, then using a mask (the mask principle will be explained next time), an electron beam hits the unwanted part, destroying its structure. After the damaged material is washed away, chemicals are used.

A solution of a strong acid with high corrosive properties is used to etch away the metal that is not protected by the photoresistance.

By removing the photoresist liquid, the remaining photoresist is dissolved, completing a workflow.

Eventually, a large number of integrated circuit chips will be completed on a complete wafer. After the square IC chips are cut out, they can be sent to a packing plant to be packaged. As for what a packing plant is, I'll explain later.